Composite electronic component and board having the same

ABSTRACT

A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body; an output terminal including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on any one or more of upper and lower surfaces and a second side surface of the capacitor; and a ground terminal disposed on any one or more of the upper and lower surfaces and a first side surface of the capacitor and connected to the internal electrodes.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2013-0094692 filed on Aug. 9, 2013, with the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND

The present disclosure relates to a composite electronic componentincluding a plurality of passive elements and a board having the same.

In accordance with the recent trend for slimness, lightness and highlevels of performance in electronic devices, the miniaturization andmultifunctionalization of electronic components included in suchelectronic devices have been required.

Electronic devices, as described above, commonly include powersemiconductor-based power management integrated circuits (PMICs), suchPMICs serving to efficiently control and manage limited batteryresources, in order to satisfy various service requirements.

However, as electronic devices are multi-functionalized, the number ofdirect current (DC)/DC converters included in PMICs has increased, andthe number of passive elements included in a power input terminal and apower output terminal of the PMIC has also increased.

In this regard, since a component arrangement area of the electronicdevice may inevitably be increased, there may be limitations on theminiaturization of electronic devices.

In addition, significant amounts of noise may be generated by wiringpatterns in the PMIC and peripheral circuits of the PMIC.

RELATED ART DOCUMENT

-   (Patent Document 1) Korean Patent Laid-Open Publication No.    2003-0014586

SUMMARY

An exemplary embodiment in the present disclosure may provide acomposite electronic component having a reduced component mounting areain a driving power supplying system, and a board having the same.

An exemplary embodiment in the present disclosure may also provide acomposite electronic component capable of suppressing the generation ofnoise in a driving power supplying system, and a board having the same.

According to an exemplary embodiment in the present disclosure, acomposite electronic component may include: a composite body having ahexahedral shape and including a capacitor and an inductor which arecoupled to each other, the capacitor having a ceramic body in which aplurality of dielectric layers and internal electrodes disposed to faceeach other with at least one of the dielectric layers interposedtherebetween are stacked, and the inductor having a magnetic body inwhich a plurality of magnetic layers having conductive patterns arestacked; an input terminal disposed on a first end surface of thecomposite body and connected to the conductive pattern of the inductor;an output terminal including a first output terminal disposed on asecond end surface of the composite body and connected to the conductivepattern of the inductor and a second output terminal disposed on any oneor more of upper and lower surfaces and a second side surface of thecapacitor; and a ground terminal disposed on any one or more of theupper and lower surfaces and a first side surface of the capacitor andconnected to the internal electrodes of the capacitor.

The internal electrodes may include first internal electrodes eachhaving a lead exposed to a first side surface of the composite body andsecond internal electrodes each having a lead exposed to the second sidesurface of the composite body.

The inductor may be disposed on the capacitor.

The capacitor and the inductor may be coupled to each other by aconductive adhesive.

According to an exemplary embodiment in the present disclosure, acomposite electronic component may include: a composite body having ahexahedral shape and including a capacitor and an inductor which arecoupled to each other, the capacitor having a ceramic body in which aplurality of dielectric layers and first and second internal electrodesdisposed to face each other with at least one of the dielectric layersinterposed therebetween are stacked, each first internal electrodehaving a lead exposed to a first side surface of the ceramic body andeach second internal electrode having a lead exposed to a second sidesurface of the ceramic body, and the inductor having a magnetic body inwhich a plurality of magnetic layers having conductive patterns arestacked; a first external electrode disposed on the first side surfaceof the ceramic body and electrically connected to the first internalelectrodes; a second external electrode disposed on the second sidesurface of the ceramic body and electrically connected to the secondinternal electrodes; first and second dummy electrodes disposed on firstand second end surfaces of the ceramic body; and third and fourthexternal electrodes disposed on first and second end surfaces of themagnetic body and connected to the conductive patterns, wherein thecomposite body includes an input terminal having the first dummyelectrode and the third external electrode which are connected to eachother, an output terminal including a first output terminal having thesecond dummy electrode and the fourth external electrode which areconnected to each other and a second output terminal having the secondexternal electrode, and a ground terminal having the first externalelectrode.

The inductor may be disposed on the capacitor.

The capacitor and the inductor may be coupled to each other by aconductive adhesive.

According to an exemplary embodiment in the present disclosure, acomposite electronic component may include: an input terminal receivingpower converted by a power management unit; a power stabilization unitstabilizing the power and including a composite body having a hexahedralshape and including a capacitor and an inductor which are coupled toeach other, the capacitor having a ceramic body in which a plurality ofdielectric layers and internal electrodes disposed to face each otherwith at least one of the dielectric layers interposed therebetween arestacked, and the inductor having a magnetic body in which a plurality ofmagnetic layers having conductive patterns are stacked; an outputterminal supplying the stabilized power; and a ground terminal forgrounding.

The input terminal may be disposed on a first end surface of thecomposite body, the output terminal may include a first output terminaldisposed on a second end surface of the composite body and a secondoutput terminal disposed on a second side surface of the composite body,and is connected to the conductive patterns of the inductor and theinternal electrodes of the capacitor, and the ground terminal may bedisposed on a lower surface and a first side surface of the compositebody and connected to the internal electrodes of the capacitor.

The internal electrodes may include first internal electrodes eachhaving a lead exposed to a first side surface of the composite body andsecond internal electrodes each having a lead exposed to a second sidesurface of the composite body.

The input terminal may have a first dummy electrode disposed on a firstend surface of the ceramic body and a third external electrode disposedon a first end surface of the magnetic body and connected to theconductive pattern, the first dummy electrode and the third externalelectrode being connected to each other, the output terminal may includea first output terminal having a second dummy electrode disposed on asecond end surface of the ceramic body and a fourth external electrodedisposed on a second end surface of the magnetic body and connected tothe conductive pattern, the second dummy electrode and the fourthexternal electrode being connected to each other, and a second outputterminal having a second external electrode disposed on a second sidesurface of the ceramic body and electrically connected to the secondinternal electrodes, and the ground terminal may have a first externalelectrode disposed on a first side surface of the ceramic body andelectrically connected to the first internal electrodes.

The inductor may be a winding inductor or a thin film inductor.

According to an exemplary embodiment in the present disclosure, a boardhaving a composite electronic component may include: a printed circuitboard on which three or more electrode pads are provided; the compositeelectronic component as described above, mounted on the printed circuitboard; and solders connecting the electrode pads and the compositeelectronic component to each other.

The electrode pads may include a first electrode pad connected to theinput terminal of the composite electronic component, a second electrodepad connected to the first and second output terminals of the compositeelectronic component, and a third electrode pad connected to the groundterminal of the composite electronic component.

The electrode pads may include a first electrode pad connected to theinput terminal of the composite electronic component, a second electrodepad connected to the first output terminal of the composite electroniccomponent, a third electrode pad connected to the second output terminalof the composite electronic component, and a fourth electrode padconnected to the ground terminal of the composite electronic component.

The second and third electrode pads may be connected to each otherthrough a via.

The inductor may be a winding inductor or a thin film inductor.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view schematically illustrating a compositeelectronic component according to an exemplary embodiment in the presentdisclosure;

FIG. 2 is an exploded perspective view schematically illustrating astacked state in the composite electronic component of FIG. 1;

FIG. 3 is a plan view illustrating internal electrodes applicable to amultilayer ceramic capacitor in the composite electronic component ofFIG. 1;

FIG. 4 is an equivalent circuit diagram of the composite electroniccomponent illustrated in FIG. 1;

FIG. 5 is a diagram illustrating a driving power supply system supplyingdriving power to a predetermined terminal requiring driving powerthrough a battery and a power management unit;

FIG. 6 is a diagram illustrating an arrangement pattern of the drivingpower supply system;

FIG. 7 is a circuit diagram of a composite electronic componentaccording to an exemplary embodiment in the present disclosure;

FIG. 8 is a diagram illustrating an arrangement pattern of a drivingpower supply system using a composite electronic component according toan exemplary embodiment in the present disclosure;

FIG. 9 is a perspective view illustrating the composite electroniccomponent of FIG. 1 mounted on a printed circuit board;

FIG. 10 is a plan view of FIG. 9;

FIG. 11 is a plan view illustrating a modified example of FIG. 9according to another exemplary embodiment in the present disclosure; and

FIG. 12 is a plan view illustrating a modified example of FIG. 9according to another exemplary embodiment in the present disclosure.

DETAILED DESCRIPTION

Exemplary embodiments of the present disclosure will now be described indetail with reference to the accompanying drawings.

The disclosure may, however, be exemplified in many different forms andshould not be construed as being limited to the specific embodiments setforth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of the disclosure to those skilled in the art.

In the drawings, the shapes and dimensions of elements may beexaggerated for clarity, and the same reference numerals will be usedthroughout to designate the same or like elements.

Composite Electronic Component

FIG. 1 is a perspective view schematically illustrating a compositeelectronic component according to an exemplary embodiment of the presentdisclosure.

FIG. 2 is an exploded perspective view schematically illustrating astacked state in the composite electronic component of FIG. 1.

FIG. 3 is a plan view illustrating internal electrodes applicable to amultilayer ceramic capacitor in the composite electronic component ofFIG. 1.

Referring to FIG. 1, in the composite electronic component according tothe exemplary embodiment of the present disclosure, an ‘L’ direction ofFIG. 1 refers to a ‘length direction,’ a ‘W’ direction of FIG. 1 refersto a ‘width direction,’ and a ‘T’ direction of FIG. 1 refers to a‘thickness direction’. Here, the ‘thickness direction’ may be the sameas a direction in which dielectric layers of the capacitor are stacked,that is, a ‘stacking direction’.

Meanwhile, the length, width, and thickness directions of the compositeelectronic component may be the same as those of a capacitor and aninductor, respectively, as described below.

In addition, in the present exemplary embodiment, the compositeelectronic component may have upper and lower surfaces opposing eachother, and first and second side surfaces and first and second endsurfaces that connect the upper and lower surfaces to each other. Ashape of the composite electronic component is not particularly limited,but may be hexahedral as illustrated.

Further, the first and second side surfaces and the first and second endsurfaces of the composite electronic component may be disposed in thesame directions as directions of first and second side surfaces andfirst and second end surfaces of the capacitor and the inductor,respectively, as described below.

Meanwhile, the composite electronic component has a form in which thecapacitor and the inductor are coupled to each other, and in the case inwhich the inductor is disposed on the capacitor, the upper surface ofthe composite electronic component may be an upper surface of theinductor, and the lower surface of the composite electronic componentmay be a lower surface of the capacitor.

Further, the first and second side surfaces may correspond to surfacesof the composite electronic component opposing each other in the widthdirection, the first and second end surfaces may correspond to surfacesof the composite electronic component opposing each other in the lengthdirection, and the upper and lower surfaces may correspond to surfacesof the composite electronic component opposing each other in thethickness direction.

Referring to FIGS. 1 through 3, the composite electronic component 100according to the exemplary embodiment of the present disclosure mayinclude a composite body 130 having an overall hexahedral shape andincluding a capacitor 110 and an inductor 120 which are coupled to eachother, wherein the capacitor 110 is formed of a ceramic body in which aplurality of dielectric layers 11 and internal electrodes 31 and 32disposed to face each other with at least one of the dielectric layers11 interposed therebetween are stacked, and the inductor 120 is formedof a magnetic body in which a plurality of magnetic layers 21 havingconductive patterns 41 are stacked.

In the present exemplary embodiment, the composite body 130 having thehexahedral shape may have upper and lower surfaces opposing each other,and first and second side surfaces and first and second end surfacesthat connect the upper and lower surfaces to each other.

A shape of the composite body 130 is not particularly limited, but maybe hexahedral as illustrated.

The composite body 130 having the hexahedral shape may be formed bycoupling the capacitor 110 and the inductor 120, and a method of formingthe composite body 130 is not particularly limited.

For example, the composite body 130 may be formed by coupling thecapacitor 110 and the inductor 120 that are separately manufacturedusing a conductive adhesive, a resin, or the like, or may be formed bysequentially stacking the ceramic body configuring the capacitor 110 andthe magnetic body configuring the inductor 120, but is not limitedthereto.

Meanwhile, according to the exemplary embodiment of the presentdisclosure, the inductor 120 may be disposed on the capacitor 110, butis not limited thereto. That is, the disposition of the inductor may bevaried.

Hereinafter, the capacitor 110 and the inductor 120 configuring thecomposite body 130 will be described in detail.

Referring to FIG. 2, the ceramic body configuring the capacitor 110 maybe formed by stacking a plurality of dielectric layers 11 a to 11 d, anda plurality of internal electrodes 31 and 32 (sequentially first andsecond internal electrodes) may be separately disposed in the ceramicbody with respective dielectric layers interposed therebetween.

The plurality of dielectric layers 11 configuring the ceramic body maybe in a sintered state and adjacent dielectric layers may be integratedwith each other, such that boundaries therebetween are not readilyapparent.

The dielectric layers 11 may be formed by sintering ceramic green sheetscontaining a ceramic powder, an organic solvent, and an organic binder.The ceramic powder may be a material having high permittivity and maycontain, but is not limited to, a barium titanate (BaTiO₃)-basedmaterial, a strontium titanate (SrTiO₃)-based material, or the like.

Meanwhile, according to the exemplary embodiment of the presentdisclosure, the internal electrodes may include the first internalelectrodes 31 each having a lead 31 a exposed to the first side surfaceof the composite body 130, and the second internal electrodes 32 eachhaving a lead 32 a exposed to the second side surface thereof, but arenot limited thereto.

More specifically, the ceramic body configuring the capacitor 110 may beformed by stacking the plurality of dielectric layers 11 a to 11 d.

The first and second internal electrodes 31 and 32 may be formed on somedielectric layers 11 b and 11 c of the plurality dielectric layers 11 ato 11 d and stacked.

According to the exemplary embodiment of the present disclosure, thefirst and second internal electrodes 31 and 32 may be formed of aconductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oralloys thereof, but is not limited thereto.

The first and second internal electrodes 31 and 32 may be printed on theceramic green sheets forming the dielectric layers 11 using theconductive paste by a printing method such as a screen printing methodor a gravure printing method.

The ceramic green sheets having the internal electrodes printed thereonmay be alternately stacked and sintered, thereby forming the ceramicbody.

Although pattern shapes of the first and second internal electrodes 31and 32 are illustrated in FIG. 3, the pattern shapes are not limitedthereto and may be varied.

The capacitor may serve to adjust a voltage supplied from a powermanagement integrated circuit (PMIC).

According to the exemplary embodiment of the present disclosure, in themagnetic body configuring the inductor 120, the plurality of magneticlayers 21 having the conductive patterns 41 may be stacked.

The magnetic body may be manufactured by printing the conductivepatterns 41 on magnetic green sheets 21 b to 21 j, stacking theplurality of magnetic green sheets 21 b to 21 j having the conductivepatterns 41 printed thereon, additionally stacking magnetic green sheets21 a and 21 k thereon and therebelow, and then sintering the stackedmagnetic green sheets.

The plurality of magnetic layers configuring the magnetic body may be ina sintered state, and adjacent magnetic layers are integrated with eachother so that boundaries therebetween are not readily apparent withoutusing a scanning electron microscope (SEM).

The magnetic layers may be formed using a Ni—Cu—Zn based ferritematerial, a Ni—Cu—Zn—Mg based ferrite material, or a Mn—Zn based ferritematerial, but are not limited thereto.

Referring to FIG. 2, the magnetic body may be formed by printing theconductive patterns 41 on the magnetic green sheets 21 b to 21 j anddrying the same, and stacking the magnetic green sheets 21 a and 21 kthereon and therebelow.

A plurality of conductive patterns 41 a to 41 f may be stacked so thatthe conductive patterns 41 in the magnetic body form a coil pattern inthe stacking direction.

The conductive patterns 41 may be formed by printing a conductive pastecontaining silver (Ag) as a main ingredient at a predeterminedthickness.

The conductive patterns 41 may be formed on both end portions of themagnetic body in the length direction and electrically connected tothird and fourth external electrodes 151 b and 152 b configuring inputand output terminals 151 and 152, respectively.

The conductive patterns 41 may include leads electrically connected tothe third and fourth external electrodes 151 b and 152 b configuring theinput terminal 151 and the output terminal 152, respectively.

Referring to FIG. 2, one conductive pattern 41 a among the conductivepatterns 41 may be electrically connected to another conductive pattern41 b, through a via electrode formed in the magnetic layer 21 interposedtherebetween, and they may form the coil pattern in the stackingdirection.

According to the exemplary embodiment of the present disclosure, thecoil pattern is not particularly limited, but may be designed inaccordance with target inductance of the inductor.

That is, second to fifth conductive patterns 41 b to 41 e may be stackedwhile forming a coil shape between a first conductive pattern 41 ahaving a lead exposed to the second end surface of the composite bodyand a sixth conductive pattern 41 f having a lead exposed to the firstend surface thereof, and the conductive patterns may be connected toeach other through via electrodes formed in the magnetic layers asdescribed above.

Although the number of respective second to fifth conductive patterns 41b to 41 e is two as illustrated in FIG. 2, the present disclosure is notlimited thereto, and the number is not limited according to the objectof the present disclosure.

In addition, although the inductor 120 illustrated in FIG. 2 is amultilayer inductor, the present disclosure is not limited thereto, andthe inductor may be a winding inductor or a thin film inductor.

The composite electronic component 100 according to the exemplaryembodiment of the present disclosure may include the input terminal 151formed on the first end surface of the composite body 130 and connectedto the conductive pattern 41 of the inductor 120; the output terminal152 including first output terminals 152 a and 152 b formed on thesecond end surface of the composite body 130 and connected to theconductive pattern 41 of the inductor 120 and a second output terminal152 c formed on any one or more of the upper and lower surfaces and thesecond side surface of the capacitor 110; and a ground terminal 153formed on any one or more of the upper and lower surfaces and the firstside surface of the capacitor 110 and connected to the internalelectrodes of the capacitor 110.

The input terminal 151 and the first output terminal 152 b may beconnected to the conductive patterns of the inductor 120 to therebyserve as the inductor in the composite electronic component.

Further, the second output terminal 152 c may be connected to the firstinternal electrodes 31 of the capacitor 110, and the second internalelectrodes 32 of the capacitor 110 may be connected to the groundterminal 153 to thereby serve as the capacitor in the compositeelectronic component.

The input terminal 151, the output terminal 152, and the ground terminal153 may be formed using a conductive paste containing a conductivemetal.

The conductive metal may be nickel (Ni), copper (Cu), tin (Sn), oralloys thereof, but is not limited thereto.

The conductive paste may further contain an insulating material, whereinthe insulating material may be, for example, glass, but is not limitedthereto.

A method of forming the input terminal 151, the output terminal 152, andthe ground terminal 153 is not particularly limited. That is, the inputterminal 151, the output terminal 152, and the ground terminal 153 maybe formed by dipping the ceramic body or may be formed by a platingmethod, or the like.

FIG. 4 is an equivalent circuit diagram of the composite electroniccomponent illustrated in FIG. 1.

Referring to FIG. 4, unlike the related art, since the inductor 120 andthe capacitor 110 are coupled to each other in the composite electroniccomponent according to the exemplary embodiment of the presentdisclosure, a distance between the inductor 120 and the capacitor 110may be designed to be set as a minimum distance, resulting in a decreasein noise.

In addition, since the inductor 120 and the capacitor 110 are coupled toeach other, a mounting area in the PMIC may be significantly decreased,whereby the composite electronic component may be advantageous forsecuring a mounting space.

Further, at the time of mounting the composite electronic component,manufacturing costs may be decreased.

Meanwhile, a composite electronic component 100 according to anotherexemplary embodiment of the present disclosure may include: a compositebody 130 having an overall hexahedral shape and including a capacitor110 and an inductor 120 which are coupled to each other, the capacitor110 being formed of a ceramic body in which a plurality of dielectriclayers 11 and first and second internal electrodes 31 and 32 disposed toface each other with at least one of the dielectric layers 11 interposedtherebetween are stacked, each first internal electrode 31 having a lead31 a exposed to a first side surface of the ceramic body and each secondinternal electrode 32 having a lead 32 a exposed to a second sidesurface of the ceramic body, and the inductor 120 being formed of amagnetic body in which a plurality of magnetic layers 21 havingconductive patterns 41 are stacked; a first external electrode 153formed on the first side surface of the ceramic body and electricallyconnected to the first internal electrodes 31; a second externalelectrode 152 c formed on the second side surface of the ceramic bodyand electrically connected to the second internal electrodes 32; firstand second dummy electrodes 151 a and 152 a formed on first and secondend surfaces of the ceramic body; and third and fourth externalelectrodes 151 b and 152 b formed on first and second end surfaces ofthe magnetic body and connected to the conductive patterns 41, whereinthe composite body 130 includes an input terminal 151 formed by theconnection between the first dummy electrode 151 a and the thirdexternal electrode 151 b, an output terminal 152 including a firstoutput terminal formed by the connection between the second dummyelectrode 152 a and the fourth external electrode 152 b and a secondoutput terminal formed of the second external electrode 152 c, and aground terminal 152 formed of the first external electrode 153.

The capacitor 110 may include the first external electrode 153 formed onthe first side surface of the ceramic body and electrically connected tothe first internal electrodes 31, the second external electrode 152 cformed on the second side surface of the ceramic body and electricallyconnected to the second internal electrodes 32, and the first and seconddummy electrodes 151 a and 152 a formed on the first and second endsurfaces of the ceramic body.

The first external electrode 153 is formed on the first side surface ofthe ceramic body, and may be extended to upper and lower surfaces of theceramic body.

The second external electrode 152 c is formed on the second side surfaceof the ceramic body, and may be extended to the upper and lower surfacesof the ceramic body.

The first and second dummy electrodes 151 a and 152 a are formed on thefirst and second end surfaces of the ceramic body, respectively, and maybe extended to the upper and lower surfaces and the first and secondside surfaces of the ceramic body.

That is, the capacitor 110 included in the composite electroniccomponent according to this exemplary embodiment of the presentdisclosure includes the first external electrode 153, the secondexternal electrode 152 c, and the first and second dummy electrodes 151a and 152 a, thereby being configured as a four-terminal capacitor.

In addition, the inductor 120 may include the third and fourth externalelectrodes 151 b and 152 b formed on the first and second end surfacesof the magnetic body and connected to the conductive patterns 41.

The third and fourth external electrodes 151 b and 152 b are formed onthe first and second end surfaces of the magnetic body, respectively,and may be extended to upper and lower surfaces and first and secondside surfaces of the magnetic body.

The first dummy electrode 151 a of the capacitor 110 and the thirdexternal electrode 151 b of the inductor 120 may be connected to eachother to form the input terminal 151 of the composite electroniccomponent.

In addition, the second dummy electrode 152 a of the capacitor 110 andthe fourth external electrode 152 b of the inductor 120 may be connectedto each other to form the first output terminal of the compositeelectronic component, and the second external electrode 152 c of thecapacitor 110 may form the second output terminal of the compositeelectronic component, such that the output terminal 152 including thefirst and second output terminals may be formed.

Meanwhile, the first external electrode 153 of the capacitor 110 may beconnected to an electrode pad on a board as a ground electrode tothereby form the ground terminal 153 of the composite electroniccomponent.

The first dummy electrode 151 a of the capacitor 110 and the thirdexternal electrode 151 b of the inductor 120 forming the input terminal151 may be connected to each other by a conductive adhesive, but thepresent disclosure is not limited thereto.

In addition, the second dummy electrode 152 a of the capacitor 110 andthe fourth external electrode 152 b of the inductor 120 forming thefirst output terminal may be connected to each other by a conductiveadhesive, but the present disclosure is not limited thereto.

Descriptions of features of the composite electronic component 100according to this exemplary embodiment of the present disclosureoverlapped with those of the composite electronic component according tothe previous exemplary embodiment of the present disclosure will beomitted in order to avoid redundancy.

FIG. 5 is a diagram illustrating a driving power supply system supplyingdriving power to a predetermined terminal requiring driving powerthrough a battery and a power management unit.

Referring to FIG. 5, the driving power supply system may include abattery 300, a first power stabilization unit 400, a power managementunit 500, and a second power stabilization unit 600.

The battery 300 may supply power to the power management unit 500. Here,the power supplied to the power management unit 500 by the battery 300is defined as first power.

The first power stabilization unit 400 may stabilize the first power V₁and supply the stabilized first power to the power management unit. Morespecifically, the first power stabilization unit 400 may include acapacitor C₁ provided between a connection terminal of the battery 300and the power management unit 500 and a ground. The capacitor C₁ mayreduce noise included in the first power.

In addition, the capacitor C₁ may have electrical charges chargedtherein. Further, in the case in which the power management unit 500instantly consumes a large amount of current, the capacitor C₁ maydischarge the charged electrical charges to suppress voltagefluctuations in the power management unit 500.

The capacitor C₁ may be a high capacitance capacitor.

The power management unit 500 may serve to convert power supplied to anelectronic device into power suitable for the electronic device, anddistribute, charge, and control the power. Therefore, the powermanagement unit 500 may generally include a DC/DC converter.

In addition, the power management unit 500 may be configured as a powermanagement integrated circuit (PMIC).

The power management unit 500 may convert the first power V₁ into secondpower V₂. The second power V₂ may be power required by a predetermineddevice connected to an output terminal of the power management unit 500and receiving driving power.

The second power stabilization unit 600 may stabilize the second powerV₂ and supply the stabilized second power to an output terminal V_(dd).The predetermined device receiving the driving power from the powermanagement unit 500 may be connected to the output terminal V_(dd).

More specifically, the second power stabilization unit 600 may includean inductor L₁ connected in series between the power management unit 500and the output terminal V_(dd). In addition, the second powerstabilization unit 600 may include a capacitor C₂ formed between aconnection terminal of the power management unit 500 and the outputterminal V_(dd) and the ground.

The second power stabilization unit 600 may reduce noise included in thesecond power V₂.

Further, the second power stabilization unit 600 may stably supply thepower to the output terminal V_(dd).

The inductor L₁ may be a power inductor to which a high level of currentmay be applied.

In addition, the capacitor C₂ may be a high capacitance capacitor.

FIG. 6 is a diagram illustrating an arrangement pattern of the drivingpower supply system.

An arrangement pattern of the power management unit 500, the powerinductor L₁, and the second capacitor C₂ may be understood withreference to FIG. 6.

Generally, the power management unit (PMIC) 500 may include several toseveral tens of DC/DC converters. Further, in order to implement afunction of the DC/DC converter, a power inductor and a high capacitancecapacitor may be required in each DC/DC converter.

Referring to FIG. 6, the power management unit 500 may includepredetermined terminals N1 and N2. The power management unit 500 mayreceive power from the battery and convert the power using the DC/DCconverters. In addition, the power management unit 500 may supply theconverted power through the first terminal N1. The second terminal N2may be a ground terminal.

Here, since the first power inductor L₁ and the second capacitor C₂receive power from the first terminal N1 and stabilize the receivedpower to supply driving power through a third terminal N3, the firstpower inductor L₁ and the second capacitor C₂ may perform functions ofthe second power stabilization unit.

Since fourth to sixth terminals N4 to N6 illustrated in FIG. 6 performthe same functions as those of the first to third terminals N1 to N3, adetailed description thereof will be omitted.

In designing the pattern of the driving power supply system, disposingthe power management unit, the power inductor, and the high capacitancecapacitor to be maximally close to each other is an importantconsideration. In addition, it is necessary for power line wirings to berelatively short and thick.

The reason for this is that a component arrangement area may bedecreased only in the case in which the above-mentioned conditions aresatisfied, and the generation of noise may be suppressed.

In the case in which the number of output terminals of the powermanagement unit 500 is small, there is no problem in disposing the powerinductor and the high capacitance capacitor to be close to each other.However, in the case in which various output terminals of the powermanagement unit 500 need to be used, the power inductor and the highcapacitance capacitor may not be normally arranged due to density ofcomponents. In addition, the power inductor and the high capacitancecapacitor may inevitably be arranged in a non-optimal state according tothe priority of power.

For example, since sizes of the power inductor and the high capacitancecapacitor are relatively large, power lines and signal lines may beinevitably elongated at the time of arranging such components.

In the case in which the power inductor and the high capacitancecapacitor are arranged in the non-optimal state, intervals betweenrespective components and the power lines may become long, therebygenerating noise. The noise may have a negative influence on the powersupply system.

FIG. 7 is a circuit diagram of a composite electronic componentaccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 7, a composite electronic component 700 may include aninput terminal unit A (input terminal), a power stabilization unit, anoutput terminal unit B (output terminal), and a ground terminal unit C(ground terminal).

The power stabilization unit may include a power inductor L₁ and asecond capacitor C₂.

The composite electronic component 700 may be capable of performingfunctions of the above-mentioned second power stabilization unit.

The input terminal unit A may be supplied with power converted by thepower management unit 500.

The power stabilization unit may stabilize the power supplied from theinput terminal unit A.

The output terminal unit B may supply the stabilized power to an outputterminal V_(dd).

The ground terminal unit C may connect the power stabilization unit tothe ground.

Meanwhile, the power stabilization unit may include the power inductorL₁ connected between the input terminal unit A and the output terminalunit B and the second capacitor C₂ connected between the ground terminalunit C and the output terminal unit.

Referring to FIG. 7, the power inductor L₁ and the second capacitor C₂share the output terminal unit B with each other, such that an intervalbetween the power inductor L₁ and the second capacitor C₂ may bedecreased.

As described above, the composite electronic component 700 may have thepower inductor and the high capacitance capacitor provided in the outputpower terminal of the power management unit 500 configured as a singlecomponent. Therefore, the degree of integration of the components in thecomposite electronic component 700 may be improved.

FIG. 8 is a diagram illustrating an arrangement pattern of a drivingpower supply system using a composite electronic component according toan exemplary embodiment of the present disclosure.

Referring to FIG. 8, it may be confirmed that the second capacitor C₂and the power inductor L₁ illustrated in FIG. 6 are replaced with thecomposite electronic component according to the exemplary embodiment ofthe present disclosure.

As described above, the composite electronic component may perform thefunctions of the second power stabilization unit.

In addition, the second capacitor C₂ and the power inductor L₁ arereplaced with the composite electronic component according to theexemplary embodiment of the present disclosure, such that a length ofwiring may be significantly decreased. In addition, as the number ofarranged components is decreased, the components may be optimallyarranged.

That is, according to the exemplary embodiment of the presentdisclosure, the power management unit, the power inductor, and the highcapacitance capacitor may be arranged to be maximally close to eachother, and the power line wiring may be designed to be short and thick.

Meanwhile, in order to satisfy user requirements, electronic devicemanufacturers have made efforts to decrease the size of printed circuitboards (PCBs) included in electronic devices. Therefore, it is necessaryto increase a degree of integration of an integrated circuit (IC)mounted in the PCB. This demand may be satisfied by configuring aplurality of components as a single composite component, similarly tothe composite electronic component according to the exemplary embodimentof the present disclosure.

In addition, according to the exemplary embodiment of the presentdisclosure, two components (the second capacitor and the power inductor)are configured as a single composite electronic component, such that amounting area at the time of being mounted on the PCB may be decreased.According to the exemplary embodiment of the present disclosure, themounting area of the two components may be decreased by about 10% to30%, as compared to existing arrangement patterns.

Further, according to the exemplary embodiment of the presentdisclosure, the power management unit 500 may supply the driving powerto the IC through the shortest wiring route.

Board Having Composite Electronic Component

FIG. 9 is a perspective view illustrating the composite electroniccomponent of FIG. 1 mounted on a printed circuit board.

FIG. 10 is a plan view of FIG. 9.

FIG. 11 is a plan view illustrating a modified example of FIG. 9according to another exemplary embodiment of the present disclosure.

FIG. 12 is a plan view illustrating a modified example of FIG. 9according to another exemplary embodiment of the present disclosure.

Referring to FIGS. 9 and 10, a board 200 having a composite electroniccomponent 100 according to the present exemplary embodiment may includea printed circuit board 210 on which the composite electronic component100 is mounted, and three or more electrode pads 221 to 223 formed onthe printed circuit board 210.

The electrode pads may include first to third electrode pads 221 to 223connected to the input terminal 151, the output terminal 152, and theground terminal 153 of the composite electronic component, respectively.

In this case, the input terminal 151, the output terminal 152, and theground terminal 153 of the composite electronic component 100 may beelectrically connected to the printed circuit board 210 by solders 230in a state in which they are positioned to contact the first to thirdelectrode pads 221 to 223, respectively.

Particularly, referring to FIGS. 9 and 10, the output terminal 152 mayinclude the first output terminals 152 a and 152 b and the second outputterminal 152 c, and the second electrode pad 222 in contact with theoutput terminal 152 may have a ‘┐’-like shape.

Referring to FIG. 11, according to another exemplary embodiment of thepresent disclosure, the electrode pads may include first to thirdelectrode pads 221′ to 223′ connected to the input terminal 151, theoutput terminal 152, and the ground terminal 153 of the compositeelectronic component 100, respectively.

According to this exemplary embodiment of the present disclosure, ashape of the second electrode pad 222′ is symmetrical with regard tothat of the second electrode pad 222 of the board for mounting of acomposite electronic component according to the above-mentionedexemplary embodiment of the present disclosure.

Meanwhile, referring to FIG. 12, according to another exemplaryembodiment of the present disclosure, the electrode pads may include afirst electrode pad 221″ connected to the input terminal 151 of thecomposite electronic component 100, a second electrode pad 222″connected to the first output terminal 152, a third electrode pad 223″connected to the second output terminal 152 c, and a fourth electrodepad 224″ connected to the ground terminal 153.

The second and third electrode pads 222″ and 223″ may be connected toeach other through a via 240, but are not limited thereto.

As set forth above, according to exemplary embodiments of the presentdisclosure, a composite electronic component having a reduced componentmounting area in a driving power supply system may be provided.

In addition, according to the exemplary embodiments of the presentdisclosure, the composite electronic component capable of suppressingthe generation of noise may be provided.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the spirit and scope ofthe present disclosure as defined by the appended claims.

What is claimed is:
 1. A composite electronic component, comprising: acomposite body having a hexahedral shape and including a capacitor andan inductor which are coupled to each other, the capacitor having aceramic body in which a plurality of dielectric layers and internalelectrodes are stacked with at least one of the dielectric layersinterposed between the internal electrodes, and the inductor having amagnetic body in which a plurality of magnetic layers having conductivepatterns are stacked; an input terminal disposed on a first end surfaceof the composite body and connected to the conductive pattern of theinductor; an output terminal including a first output terminal disposedon a second end surface of the composite body and connected to theconductive pattern of the inductor and a second output terminal disposedon any one or more of upper and lower surfaces and a second side surfaceof the capacitor; and a ground terminal disposed on anyone or more ofthe upper and lower surfaces and a first side surface of the capacitorand connected to the internal electrodes of the capacitor.
 2. Thecomposite electronic component of claim 1, wherein the internalelectrodes include: first internal electrodes each having a lead exposedto a first side surface of the composite body; and second internalelectrodes each having a lead exposed to the second side surface of thecomposite body.
 3. The composite electronic component of claim 1,wherein the inductor is disposed on the capacitor.
 4. The compositeelectronic component of claim 1, wherein the capacitor and the inductorare coupled to each other by a conductive adhesive.
 5. A compositeelectronic component, comprising: a composite body having a hexahedralshape and including a capacitor and an inductor which are coupled toeach other, the capacitor having a ceramic body in which a plurality ofdielectric layers and first and second internal electrodes disposed toface each other with at least one of the dielectric layers interposedtherebetween are stacked, each first internal electrode having a leadexposed to a first side surface of the ceramic body and each secondinternal electrode having a lead exposed to a second side surface of theceramic body, and the inductor having a magnetic body in which aplurality of magnetic layers having conductive patterns are stacked; afirst external electrode disposed on the first side surface of theceramic body and electrically connected to the first internalelectrodes; a second external electrode disposed on the second sidesurface of the ceramic body and electrically connected to the secondinternal electrodes; first and second dummy electrodes disposed on firstand second end surfaces of the ceramic body; and third and fourthexternal electrodes disposed on first and second end surfaces of themagnetic body and connected to the conductive patterns, wherein thecomposite body includes an input terminal having the first dummyelectrode and the third external electrode which are connected to eachother, an output terminal including a first output terminal having thesecond dummy electrode and the fourth external electrode which areconnected to each other and a second output terminal having the secondexternal electrode, and a ground terminal having the first externalelectrode.
 6. The composite electronic component of claim 5, wherein theinductor is disposed on the capacitor.
 7. The composite electroniccomponent of claim 5, wherein the capacitor and the inductor are coupledto each other by a conductive adhesive.
 8. A composite electroniccomponent, comprising: an input terminal receiving power converted by apower management unit; a power stabilization unit stabilizing the powerand including a composite body having a hexahedral shape and including acapacitor and an inductor which are coupled to each other, the capacitorhaving a ceramic body in which a plurality of dielectric layers andinternal electrodes disposed to face each other with at least one of thedielectric layers interposed therebetween are stacked, and the inductorhaving a magnetic body in which a plurality of magnetic layers havingconductive patterns are stacked; an output terminal supplying thestabilized power; and a ground terminal for grounding.
 9. The compositeelectronic component of claim 8, wherein the input terminal is disposedon a first end surface of the composite body, the output terminalincludes a first output terminal disposed on a second end surface of thecomposite body and a second output terminal disposed on a second sidesurface of the composite body, and is connected to the conductivepatterns of the inductor and the internal electrodes of the capacitor,and the ground terminal is disposed on a lower surface and a first sidesurface of the composite body and connected to the internal electrodesof the capacitor.
 10. The composite electronic component of claim 8,wherein the internal electrodes include: first internal electrodes eachhaving a lead exposed to a first side surface of the composite body; andsecond internal electrodes each having a lead exposed to a second sidesurface of the composite body.
 11. The composite electronic component ofclaim 10, wherein the input terminal has a first dummy electrodedisposed on a first end surface of the ceramic body and a third externalelectrode disposed on a first end surface of the magnetic body andconnected to the conductive pattern, the first dummy electrode and thethird external electrode being connected to each other, the outputterminal includes a first output terminal having a second dummyelectrode disposed on a second end surface of the ceramic body and afourth external electrode disposed on a second end surface of themagnetic body and connected to the conductive pattern, the second dummyelectrode and the fourth external electrode being connected to eachother, and a second output terminal having a second external electrodedisposed on a second side surface of the ceramic body and electricallyconnected to the second internal electrodes, and the ground terminal hasa first external electrode disposed on a first side surface of theceramic body and electrically connected to the first internalelectrodes.
 12. The composite electronic component of claim 1, whereinthe inductor is a winding inductor or a thin film inductor.
 13. Thecomposite electronic component of claim 5, wherein the inductor is awinding inductor or a thin film inductor.
 14. The composite electroniccomponent of claim 8, wherein the inductor is a winding inductor or athin film inductor.
 15. A board having a composite electronic component,the board comprising: a printed circuit board on which three or moreelectrode pads are provided; the composite electronic component of claim1 mounted on the printed circuit board; and solders connecting theelectrode pads and the composite electronic component to each other. 16.The board of claim 15, wherein the electrode pads include: a firstelectrode pad connected to the input terminal of the compositeelectronic component; a second electrode pad connected to the first andsecond output terminals of the composite electronic component; and athird electrode pad connected to the ground terminal of the compositeelectronic component.
 17. The board of claim 15, wherein the electrodepads include: a first electrode pad connected to the input terminal ofthe composite electronic component; a second electrode pad connected tothe first output terminal of the composite electronic component; a thirdelectrode pad connected to the second output terminal of the compositeelectronic component; and a fourth electrode pad connected to the groundterminal of the composite electronic component.
 18. The board of claim15, wherein the second and third electrode pads are connected to eachother through a via.
 19. The board of claim 15, wherein the inductor isa winding inductor or a thin film inductor.
 20. A board having acomposite electronic component, the board comprising: a printed circuitboard on which three or more electrode pads are provided; the compositeelectronic component of claim 5 mounted on the printed circuit board;and solders connecting the electrode pads and the composite electroniccomponent to each other.
 21. The board of claim 20, wherein theelectrode pads include: a first electrode pad connected to the inputterminal of the composite electronic component; a second electrode padconnected to the first and second output terminals of the compositeelectronic component; and a third electrode pad connected to the groundterminal of the composite electronic component.
 22. The board of claim20, wherein the electrode pads include: a first electrode pad connectedto the input terminal of the composite electronic component; a secondelectrode pad connected to the first output terminal of the compositeelectronic component; a third electrode pad connected to the secondoutput terminal of the composite electronic component; and a fourthelectrode pad connected to the ground terminal of the compositeelectronic component.
 23. The board of claim 20, wherein the second andthird electrode pads are connected to each other through a via.
 24. Theboard of claim 20, wherein the inductor is a winding inductor or a thinfilm inductor.
 25. Aboard having a composite electronic component, theboard comprising: a printed circuit board on which three or moreelectrode pads are provided; the composite electronic component of claim8 mounted on the printed circuit board; and solders connecting theelectrode pads and the composite electronic component to each other. 26.The board of claim 25, wherein the electrode pads include: a firstelectrode pad connected to the input terminal of the compositeelectronic component; a second electrode pad connected to the first andsecond output terminals of the composite electronic component; and athird electrode pad connected to the ground terminal of the compositeelectronic component.
 27. The board of claim 25, wherein the electrodepads include: a first electrode pad connected to the input terminal ofthe composite electronic component; a second electrode pad connected tothe first output terminal of the composite electronic component; a thirdelectrode pad connected to the second output terminal of the compositeelectronic component; and a fourth electrode pad connected to the groundterminal of the composite electronic component.
 28. The board of claim25, wherein the second and third electrode pads are connected to eachother through a via.
 29. The board of claim 25, wherein the inductor isa winding inductor or a thin film inductor.